The 2026 China Electronic Copper Foil Industry Summit is in Wuhan, Hubei Province from May 28 to 30, 2026.   The electronic copper foil industry maintained a recovery momentum in 2026 with abundant orders and steadily rising processing fees. Multiple growth drivers are at play: the accelerated construction of AI computing power has triggered explosive demand for high-end copper foils such as HVLP for intelligent terminals. Meanwhile, the booming new energy sector, coupled with the impact of recent geopolitical tensions on the global energy system, has created a vital development window for electronic copper foil, an essential basic material.   Nevertheless, the industry is confronted with structural overcapacity: low-end production capacity is surplus while high-end capacity remains insufficient. The dividends from capacity expansion are fading, marking an era where technological strength becomes the core competitiveness. Against this backdrop, the 2026 China Electronic Copper Foil Industry Summit is hosted in Wuhan, a transportation hub of central China. Centered on the theme "Address Structural Overcapacity, Realize Independent Operation and Value Co-creation", the summit aims to chart a new course for the industry and drive its transformation from blind low-end expansion to a new ecosystem of value co-creation.   During the event, we will showcase our newly developed innovative product portfolio. Featuring outstanding performance and distinctive application strengths, these products fully meet stringent market requirements, as detailed below:   PCU-S80   Mercapto silane oligomer is a type of oligomeric organosilicon compound containing active mercapto groups (-SH) and hydrolyzable siloxane structures. Compared with monomeric silanes, it delivers more uniform film formation, higher stability, greater functionality and superior reactivity. Thanks to its unique chemical structure, it finds wide applications in surface treatment, coatings, environmental protection and other fields.   It can inhibit oxidation, corrosion and discoloration of metals; improve the adhesion, weather resistance, abrasion resistance and anti-corrosion performance of coatings; and immobilize heavy metal ions in soil to prevent their migration and diffusion.   PCU-T   As a methylbenzotriazole derivative soluble in water-based systems, PCU-T serves as an efficient non-ferrous metal corrosion inhibitor, especially for copper. Different from conventional methylbenzotriazole, PCU-T disperses evenly within the film layer without causing surface defects such as oil stains and craters, and exerts no adverse effects on the adhesion and gloss of coatings. It is widely applied in water-based copper-gold paste coatings and metal pipeline water treatment.    

The 2026 China Electronic Copper Foil Industry Summit Forum is scheduled to be held in Wuhan, Hubei Province from May 28 to 30, 2026.   The electronic copper foil industry will continue its recovery momentum in 2026, with sufficient orders and steadily rising processing fees. The driving factors are as follows: the comprehensive acceleration of AI computing power construction has fueled an explosive growth in demand for high-end copper foils such as HVLP for smart terminals; the continuous expansion of demand in the new energy sector, coupled with the impact of recent geopolitical conflicts on the global energy system, has presented a critical development window for electronic copper foil as a key basic material.   Nevertheless, the industry is confronted with a structural overcapacity crisis — oversupply of low-end capacity and shortage of high-end capacity. The dividends of scale expansion are fading away, ushering in an era where technological innovation determines market competitiveness. Faced with historic opportunities, the 2026 China Electronic Copper Foil Industry Summit Forum will take place in Wuhan, a transportation hub known as the "Thoroughfare to Nine Provinces". Centered on the theme "Resolving Structural Overcapacity Crisis, Realizing Independent Governance and Value Co-creation", the forum aims to jointly explore new development directions and drive the industry’s transformation from low-end capacity expansion to a new ecosystem of value co-creation.   During the forum, we will showcase a lineup of newly developed innovative products. With superior performance and unique application advantages, these products meet the stringent standards of the market, detailed as follows:   PCU-S80: Mercapto silane oligomer is a type of oligomeric organosilicon compound containing reactive mercapto groups (-SH) and hydrolyzable siloxane structures. Compared with monomeric silane, it features more uniform film formation, higher stability, greater functionality and better reactivity. Thanks to its unique chemical structure, it is widely applied in surface treatment, coatings, environmental protection and other fields. It can inhibit metal oxidation, corrosion and discoloration; improve the adhesion, weather resistance, wear resistance and anti-corrosion performance of coatings; and immobilize heavy metal ions in soil to prevent their migration and diffusion.   PCU-T: A methyl benzotriazole derivative soluble in aqueous systems, it serves as an efficient non-ferrous metal protective agent with excellent corrosion inhibition performance especially for copper. Compared with methyl benzotriazole, PCU-T can disperse evenly in the film layer without causing surface defects such as oil spots and craters, and it does not compromise the adhesion or gloss of the coating film. It has been effectively applied in water-based copper-gold paste coatings and metal pipeline water treatment.   PCU-1105: It is a high-end eco-friendly passivation agent for metals. Compared with conventional passivation agents, it boasts outstanding corrosion resistance, high heat resistance, excellent chemical resistance, low VOC content and high bonding strength, and contains no toxic substances such as chromium and cadmium. It delivers high reactivity and maintains superior performance even at a low curing temperature of 80°C. Tests show that copper foil treated with 5% PCU-1105 remains discoloration-free after being heated at 170°C for 10 minutes.   Our company is committed to improving product quality and customer experience through technological innovation. We aim to meet the growing demands of the electronic copper foil industry via continuous new product R&D, while providing high-quality services and support for customers.   We look forward to meeting you in Wuhan to discuss the future development of the electronic copper foil industry. Please stay tuned to our official website for more details on new products and latest market updates.

China's electronic copper foil industry is in a critical period of transformation and upgrading. With the rapid development of emerging industries such as 5G communications, new energy vehicles and artificial intelligence, the demand for high-end electronic copper foil featuring high-frequency & high-speed performance, ultra-thin thickness and high strength keeps growing. Against this backdrop, the 16th China Electronic Copper Foil Technology Seminar will be held at the InterContinental Hotel of Shenzhen World Exhibition & Convention Center from November 19 to 21, 2025, with the theme of "Collaboration · Breakthrough · Leadership – Co-building a New Ecosystem for the Copper Foil Industry".   Wuhan Hugarise New Material Co.,Ltd. will participate in this grand event as a sponsoring organization. As a global highland for electronic manufacturing, Shenzhen and the Greater Bay Area gather a large number of terminal giants as well as leading enterprises in industries such as copper clad laminates (CCL), printed circuit boards (PCB) and batteries, forming one of the most complete electronic information industry chains worldwide. This seminar will provide a platform for in-depth docking between copper foil manufacturers and downstream application sectors, promoting the close integration of technological innovation and market application.   During the seminar, our company will showcase its latest technological achievements and innovative products, including:   Innovations in Electroplating Chemicals   H1: Enhances the corrosion resistance of copper foil; this high-purity product prevents edge tearing. ZPS: Serves as a brightener for acid copper plating. When used in combination with polyethers and wetting agents, it yields bright and highly ductile plating layers. SM110: Refines crystal grains, improves the leveling property and hardness of plating layers, and significantly boosts the tensile strength of copper foil. SN110: Refines crystal grains, improves the leveling property and hardness of plating layers, and significantly boosts the tensile strength of copper foil.   Innovations in Anti-oxidation Series   PCU-T (Methylbenzotriazole Derivative): Soluble in aqueous systems, it is an effective corrosion inhibitor for non-ferrous metals, especially for copper. It can replace benzotriazole and methylbenzotriazole. PCU-B (Benzotriazole Silane Oligomer): Mainly applied in metal surface treatment and anti-corrosion fields. As a corrosion inhibitor, it improves the oxidation resistance of materials; as a silane coupling agent, it enhances the adhesion performance of materials and provides long-lasting rust and corrosion protection. PCU-A18 (Vinyl Silane Oligomer): Mainly used as an anti-corrosion coating and adhesion promoter. It can significantly improve the corrosion resistance of metals (such as steel, copper, aluminum, etc.) and enhance coating adhesion, while also possessing hydrophobicity and weather resistance. With a high vinyl group content in its structure, it is suitable for bonding flexible materials. Compared with monomer silanes, this oligomer forms a more uniform film, has a longer shelf life and higher stability. PCU-K11 (Epoxy Silane Oligomer): Mainly used as an anti-corrosion coating and adhesion promoter. It can significantly improve the corrosion resistance of metals (such as steel, copper, aluminum, etc.) and enhance coating adhesion, while also possessing hydrophobicity and weather resistance. With a high epoxy group content in its structure, it forms stable chemical bonds through ring-opening reaction, making it suitable for meeting the durability requirements of rigid composite materials. Compared with monomer silanes, this oligomer forms a more uniform film, has a longer shelf life and higher stability. PCU-1105 (Silane Oligomer): A high-performance and environmentally friendly passivation treatment agent. It is suitable for the passivation of copper or copper alloys, and can also be used for the passivation of non-ferrous metals such as iron, nickel and chromium.

  ‌“2025 China Electronic Copper Foil Industry Summit Forum”‌ will be held from ‌May 26 to 28, 2025‌ in ‌Nanchang, Jiangxi Province‌! Following the challenges of global supply chain adjustments and technological iterations in 2024, China’s electronic copper foil industry is accelerating its transformation toward a ‌"technology-driven + full-chain collaboration"‌ model. Under the theme ‌"Breakthrough · Momentum · Leap"‌, this forum focuses on ‌optimizing existing capacities, technological innovation, and ecosystem restructuring‌, serving as a critical platform to seize key opportunities in the industry’s transformation. To further advance electronic copper foil technology and promote innovative products, ‌Wuhan Hugarise New Material Co., Ltd.‌ will participate in the ‌“2025 China Electronic Copper Foil Industry Summit Forum”‌ in Nanchang. The forum will gather industry leaders to showcase cutting-edge technological achievements and market trends. During the event, we will highlight a series of newly developed innovative products. These products meet the market’s high-standard requirements through exceptional performance and unique application advantages, as detailed below: ‌‌NEOS‌‌: Direct replacement for protein peptides, stable performance without degradation. ‌‌PCU Series‌‌: Enhances copper oxidation resistance with broad applicability in aqueous systems. ‌‌110 Series‌‌: High-resistance copper foil with ultra-high purity, eliminating edge tearing. Our company is committed to improving product quality and customer experience through technological innovation. Our goal is to continuously develop new products to meet the growing demands of the electronic copper foil industry and provide customers with the highest-quality services and support. We look forward to meeting you in Nanchang to jointly explore the future development of the electronic copper foil industry! Please stay tuned to our official website for more detailed information about our new products and market updates.

‌"The 15th China Electronic Copper Foil Technology Symposium"‌ will be held from ‌November 28 to 30, 2024‌, in ‌Jiaxing City, Zhejiang Province‌. As a dedicated player in electronic chemicals, ‌Wuhan Hugarise New Material Co.,Ltd‌ has been invited once again to participate and collaborate with industry peers in discussing the latest advancements and future trends in electronic copper foil technology. After three years of rapid scale expansion, China's electronic copper foil industry has entered an adjustment phase. Facts demonstrate that mere capacity expansion is not the ultimate path for corporate development; enhancing "soft power" aligns better with current demands. To strengthen connections between copper foil enterprises and upstream/downstream industries, and to establish a new strategic framework focused on terminal demand-driven product upgrades and rapid response to new technological requirements, the ‌Electronic Copper Foil Materials Branch of the China Electronic Materials Industry Association‌ has decided to organize this symposium. The theme of this symposium is ‌"Strengthening Industrial Chain Interconnectivity and Upholding Collaborative Integrated Development"‌. The event will invite experts from national ministries, electronic copper foil industry specialists, and upstream/downstream professionals to deliver insightful reports. Discussions will span macro, meso, and micro levels, addressing ‌new technologies, processes, materials, equipment‌, and future trends in electronic copper foil through extensive and in-depth exchanges. At this symposium, our company is not only an active participant but also an innovator. We have launched ‌three new products‌ tailored for the electronic copper foil sector, aiming to drive industrial advancement through technological innovation and deliver ‌more efficient, environmentally friendly, and high-performance solutions‌ to our clients: ‌Aliphatic Polyoxyethylene Ether Sulfonate (NEOS)‌: This product is an innovative solution inspired by the structural design of hydrolyzed protein peptides. It retains the electrochemical performance of protein peptides while offering superior chemical stability and oxidation resistance, enhancing the mechanical properties of both raw and processed copper foil. It can replace hydrolyzed protein peptides to improve plating brightness, brightening range, and wettability. ‌Water-Soluble Copper Protector (PCU)‌: Soluble in aqueous systems, this product serves as an effective non-ferrous metal protector, particularly excelling in copper corrosion inhibition. It can replace ‌benzotriazole (BTA)‌ and ‌tolyltriazole (TTA)‌, and is suitable for aqueous anti-oxidation systems in various copper and alloy substrates. ‌Sodium Thiazolinyl Dithiopropane Sulfonate (SH110)‌: This product refines grain structure, improves coating leveling, and enhances hardness. It is used in decorative and functional electroplating for hardware copper plating, electroformed copper, printed circuit boards, and lithium battery copper foil. In lithium battery copper foil electroplating processes, it significantly boosts copper foil tensile strength. The ‌15th China Electronic Copper Foil Technology Symposium‌ not only provides a crucial platform for cross-industry communication and collaboration but also marks another leap forward in our company's technological innovation in electronic copper foil. We believe that through continuous R&D and product innovation, we can propel the electronic copper foil industry toward ‌greener and smarter development‌ while contributing to the growth of the electronics sector. Moving forward, ‌Wuhan Hugarise New Material Co.,Ltd will adhere to the principle of ‌"Strengthening Industrial Chain Interconnectivity and Upholding Collaborative Integrated Development"‌, working hand-in-hand with industry peers to achieve new milestones in electronic copper foil technology.