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Provide innovative electrochemical and anti-oxidation products for the development of the copper foil industry
2026/04/01
China's electronic copper foil industry is in a critical period of transformation and upgrading. With the rapid development of emerging industries such as 5G communications, new energy vehicles and artificial intelligence, the demand for high-end electronic copper foil featuring high-frequency & high-speed performance, ultra-thin thickness and high strength keeps growing. Against this backdrop, the 16th China Electronic Copper Foil Technology Seminar will be held at the InterContinental Hotel of Shenzhen World Exhibition & Convention Center from November 19 to 21, 2025, with the theme of "Collaboration · Breakthrough · Leadership – Co-building a New Ecosystem for the Copper Foil Industry".
Wuhan Hugarise New Material Co.,Ltd. will participate in this grand event as a sponsoring organization. As a global highland for electronic manufacturing, Shenzhen and the Greater Bay Area gather a large number of terminal giants as well as leading enterprises in industries such as copper clad laminates (CCL), printed circuit boards (PCB) and batteries, forming one of the most complete electronic information industry chains worldwide. This seminar will provide a platform for in-depth docking between copper foil manufacturers and downstream application sectors, promoting the close integration of technological innovation and market application.
During the seminar, our company will showcase its latest technological achievements and innovative products, including:
Innovations in Electroplating Chemicals
- H1: Enhances the corrosion resistance of copper foil; this high-purity product prevents edge tearing.
- ZPS: Serves as a brightener for acid copper plating. When used in combination with polyethers and wetting agents, it yields bright and highly ductile plating layers.
- SM110: Refines crystal grains, improves the leveling property and hardness of plating layers, and significantly boosts the tensile strength of copper foil.
- SN110: Refines crystal grains, improves the leveling property and hardness of plating layers, and significantly boosts the tensile strength of copper foil.
Innovations in Anti-oxidation Series
- PCU-T (Methylbenzotriazole Derivative): Soluble in aqueous systems, it is an effective corrosion inhibitor for non-ferrous metals, especially for copper. It can replace benzotriazole and methylbenzotriazole.
- PCU-B (Benzotriazole Silane Oligomer): Mainly applied in metal surface treatment and anti-corrosion fields. As a corrosion inhibitor, it improves the oxidation resistance of materials; as a silane coupling agent, it enhances the adhesion performance of materials and provides long-lasting rust and corrosion protection.
- PCU-A18 (Vinyl Silane Oligomer): Mainly used as an anti-corrosion coating and adhesion promoter. It can significantly improve the corrosion resistance of metals (such as steel, copper, aluminum, etc.) and enhance coating adhesion, while also possessing hydrophobicity and weather resistance. With a high vinyl group content in its structure, it is suitable for bonding flexible materials. Compared with monomer silanes, this oligomer forms a more uniform film, has a longer shelf life and higher stability.
- PCU-K11 (Epoxy Silane Oligomer): Mainly used as an anti-corrosion coating and adhesion promoter. It can significantly improve the corrosion resistance of metals (such as steel, copper, aluminum, etc.) and enhance coating adhesion, while also possessing hydrophobicity and weather resistance. With a high epoxy group content in its structure, it forms stable chemical bonds through ring-opening reaction, making it suitable for meeting the durability requirements of rigid composite materials. Compared with monomer silanes, this oligomer forms a more uniform film, has a longer shelf life and higher stability.
- PCU-1105 (Silane Oligomer): A high-performance and environmentally friendly passivation treatment agent. It is suitable for the passivation of copper or copper alloys, and can also be used for the passivation of non-ferrous metals such as iron, nickel and chromium.
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