1.  Industry Pain Points and Core Application Value of H1 Additives

In electrolytic copper‑foil production and copper‑plating processes, tensile strength serves as a core indicator governing copper‑foil quality and applications, directly determining its processing stability and service life in PCB manufacturing, lithium‑battery packaging and flexible circuits. Copper foils made by conventional processes often suffer coarse grains, loose structures and uneven stress, resulting in insufficient tensile properties as well as fractures, deformation and wrinkling during processing. The additives based on 2-Mercaptothiazoline (H1) features unique molecular structures and electrochemical modulation effects. It optimizes micro‑grain structures to comprehensively improve tensile strength while balancing surface brightness, leveling performance and deposition efficiency, making it a critical functional additive for high‑end copper‑foil manufacturing.

2.  Molecular Structural Advantages of H1 and Mechanisms for Copper Foil Performance Enhancement

As the core parent material for enhancing the mechanical properties of electrolytic copper foil, H1 features a distinctive sulfur‑nitrogen heterocyclic molecular structure that delivers superior cathode‑adsorption and deposition‑modulation capabilities. During electroplating, H1 selectively adsorbs onto copper‑ion deposition sites to precisely regulate the reduction‑deposition rate of copper ions. It suppresses the disordered coarsening of copper grains and facilitates uniform, compact grain arrangement, thereby substantially mitigating grain‑boundary defects and dislocation imperfections within the copper‑foil crystal matrix. Such well‑ordered and dense microcrystalline structure remarkably improves the tensile and deformation‑resistant performance, fundamentally elevating the tensile strength of copper foil and addressing the inherent drawbacks of conventional copper foil including poor ductility and high fracture susceptibility.

H1 exhibits outstanding brightening and leveling functions. It rapidly fills micro‑pits on copper‑foil surfaces to reduce surface roughness and achieve mirror‑grade brightness. Its fast brightening response also optimizes production efficiency, making it well‑suited for high‑speed continuous copper‑foil manufacturing lines.

3.  Synergistic Enhancement Mechanism of H1 Derivative Additive System

Based on H1’s superior parent molecular skeleton, a series of high-performance customized additives have been developed to broaden the process applicability of high-tensile copper foil and achieve targeted performance optimization. Four derivatives, including Sodium Thiazolinyl Dithiopropane Sulfonate (SH110), Sodium Benzimidazolyl Dithiopropanesulfonate (SM110), Sodium Ethylene Thiourea Dithiopropanesulfonate (SN110) and Sodium 2-mercaptothiazoline Propanesulfonate (HPS), retain H1’s core strength of enhancing copper foil tensile properties. Optimized molecular structures enable their compatibility with various plating bath systems and parameters. These synergistic derivatives refine grains, balance deposition stress and improve copper foil structural compactness, delivering high tensile strength and excellent flexibility to meet production demands for ultra-thin and ultra-soft high-end copper foil.

Sodium Dimethylformamido Propanesulfonate (TPS) serves as a vital auxiliary additive that establishes an efficient synergistic system with H1 and its four derivatives. It optimizes the electrochemical behaviors of plating baths, enhances copper deposition uniformity, and eliminates local stress concentration. By compensating for the inherent limitations of individual additives, TPS stabilizes the microscopic structure of copper foil and sustains stable tensile strength. Furthermore, this compound additive system exhibits excellent compatibility with conventional acidic copper plating solutions and superior process stability, enabling simultaneous improvement in the mechanical performance and surface quality of copper foil without extensive production parameter modifications.

4.  Enterprise Technical System and Industrial Application Advantages

 

Wuhan Hugarise New Material Co., Ltd. specializes in the R&D and production of electroplating functional intermediates. It has developed an H1-centered additive system that forms a complete performance enhancement path of grain refinement, stress balancing and structural strengthening. This system greatly boosts copper foil tensile strength while delivering fast brightening, excellent leveling and high flatness. Adaptable to standard PCB, ultra-thin lithium battery and flexible circuit copper foil, it reduces processing loss and improves product qualification rate, providing core technical support for high-quality and efficient industrial production of high-end copper foil.

Wuhan Hugarise New Material Co., Ltd.

Email: info@hugarise.com

Tel: +86 027 85838885

Mobile: +86 153 9154 7019  +86 132 9661 3823

Add: Room 811, Building E, Wuhan Living Room Exhibition Center, Dongxihu District, Wuhan, Hubei, China